News

TERASi develops highly compact E-band filters for 5G radio systems, offering industry leading performance in a package 40 times smaller than conventional solutions.

TERASi reveals its cutting-edge Aircore™ System-in-Package (SiP) solution for mm-wave front-end modules.

TERASi announced the successful completion of its wafer-scale Aircore™ packaging technology, marking a significant milestone in the development of next-generation communication technologies.

TERASi's goal is to build hardware to enable our wireless future. Enabling is a matter of making something feasible through increased performance, cost-effectiveness or efficiency. Today we are delighted to announce the release of three new product lines which do all of this, and more.

Stockholm, Sweden - 6th March 2024 TERASi, a pioneering startup at the forefront of wireless hardware technology, is excited to announce the appointment of its new board of directors. The newly appointed board members are distinguished leaders known for their strategic vision and proven track record in telecom, ICT and

TeraSi raises 13 MSEK to drive the development of their proprietary system-in-package technology. The funding comes from Navigare Ventures, Almi Invest, Onsight Ventures and Deeptech Labs as well as follow-on investments from all existing investors.