Stockholm, Sweden – April 3, 2025 - TERASi, a pioneer in innovative communication solutions, has once again proven its technical prowess in wireless hardware with the reveal of its cutting-edge System-in-Package (SiP) solution for mm-wave front-end modules. This breakthrough builds on a key innovation: wideband, high-efficiency chip-to-package interconnects that merge TERASi’s Aircore™ packaging technology with commercial grade semiconductor chips. Aircore's superior performance now powers complete RF front-ends, paving the way for highly integrated modules designed for the next wave of communication and sensing.

Bandwidth limitations have long stifled high-capacity wireless and high-resolution sensing. High frequency bands like E-band (71-86 GHz) and D-band (110-170 GHz) offer the solution, but designing efficient RF front-ends at these frequencies is a major challenge. TERASi has overcome this by leveraging The Leibniz Institute for High Performance Microelectronics (IHP)’s advanced 0.13 um SiGe BiCMOS semiconductor technology within TERASi’s novel SiP platform. This allows for the creation of high-performance electronics with integrated digital and analog functionality on a single chip, alongside highly efficient passives embedded in TERASi’s Aircore™ package.

"Our 0.13μm BiCMOS platform features the world’s fastest silicon transistors, ideal for communication, radar, and sensing applications in the D-band (110-170GHz) and beyond. However, interfacing circuits at these frequencies has always been a major challenge, which is why we were excited to collaborate with TERASi. Their technology allows to package chips  with exact same contact structures that we must use for characterization; enabling faster, more cost-effective prototypes and product development at a level we previously had no access to," shared Prof. Corrado Carta, Department Head - Circuit Design, IHP Microelectronics.

Extracting the high frequency signal from the chip with minimal power loss and without the need for specialized interfaces has always been a critical challenge. TERASi’s Aircore™ system-in-package (SiP) platform provides the solution, delivering over 95% RF efficiency without requiring any redesigns or custom interfaces. The RF signal is then routed through wideband, high-efficiency antennas within the package. This breakthrough eliminates the need for on-chip antennas, significantly reducing chip costs while optimizing the system’s size, weight, and performance ratio (SWaP).

“TERASi’s cutting-edge technology, combined with IHP’s microelectronic expertise, enables us to deliver high-capacity, energy-efficient modules tailored for 5G and 6G applications,” added James Campion, CEO of TERASi. “This development marks a clear shift in our strategy where we now focus on delivering integrated mm-wave modules. Our unique technology significantly enhances the performance of next-generation radio front-ends, setting a new standard in the industry.”

This innovation paves the way for the development of high-performance front-end modules for next-generation wireless communication, and sensing applications. The combination of TERASi’s Aircore™ SiP platform and IHP’s semiconductor technology enables the creation of complete transceiver (TRX) front-end modules for D-band that support capacities up to 100 Gbps, opening up new possibilities for high-datarate connectivity. Shifting key RF front-end elements to TERASi's package allows for reduced die sizes, providing significant cost reduction for complete modules. Active beamsteering can be achieved by integrating controllable delay elements in the front-end stack.

With this groundbreaking solution, TERASi and IHP Microelectronics are not only demonstrating the unique capabilities of their technology but are also reinforcing Europe's position at the forefront of global wireless innovation. 

About TERASi

TERASi specializes in next-generation high-frequency wireless solutions that combine cutting-edge design techniques and scalable manufacturing. TERASi’s breakthrough Aircore™ technology enables high-performance, high-volume production of system-in-package modules, driving advancements in 5G, 6G, and beyond. With a focus on innovation, scalability, and efficiency, TERASi is reshaping how communication technologies are developed and deployed at scale. For more information, visit TERASi.

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