Stockholm, Sweden – March 26, 2025 – TERASi announced the successful completion of its wafer-scale Aircore™ packaging technology, marking a significant milestone in the development of next-generation communication technologies. This breakthrough enables the mass production of complete wafer-scale mm-wave modules, a step that dramatically enhances the commercial viability of TERASi’s radical offerings. By integrating cutting-edge manufacturing, novel passive component technologies, and automated assembly, TERASi can now deliver high-performance, large-scale components that will serve as the foundation for future communication & surveillance networks.
Previously, TERASi’s Aircore™ advanced packaging platform incorporated several chip-scale processes, which posed certain challenges for the commercial viability of their next-gen devices. With the introduction of the true wafer-scale Aircore™ platform, TERASi has significantly enhanced the production process. This innovation eliminates manual processes and introduces a fully automated solution, optimized for high-volume manufacturing. This supports complete mm-wave system-in-package modules through a full wafer scale process, advancing TERASi’s capabilities for next-level device development.
“We are excited to make this monumental leap in mm-wave advanced packaging”, added James Campion, CEO of TERASi. “The development of these D-band antennas will pave the way for the next generation of 6G communication networks, with unprecedented speed and performance. This milestone not only validates our technology but also sets us apart as a frontrunner in the industry.”
The development of wafer-scale Aircore™ is a testament to TERASI’s relentless commitment to innovation and excellence in the field of high-frequency communication technologies. The technology offers state-of-the-art efficiency, drastically improving overall signal to noise ratio and link performance. Seamless integration of multiple components in a wafer-scale process will not only solve technical problems but also deliver real-world value to industries that demand the highest performance and reliability.
The new wafer-scale Aircore™ platform was leveraged to develop cutting-edge antennas designed to meet the growing demands of high-speed communication.The antennas are engineered for wideband operation across the entire D-band to support capacities up to 100 Gbps. Developed in collaboration with Tokyo Institute of Technology, these innovative devices were successfully delivered to the customer in early 2025, marking a significant step forward in the evolution of high-speed communication solutions.
About TERASi:
TERASi is a Swedish-based company specializing in developing and delivering next-generation high-frequency wireless solutions that combine cutting-edge design techniques and scalable manufacturing. The breakthrough Aircore™ technology enables high-performance, high-volume production of system-in-package modules, driving advancements in 5G, 6G, and beyond. With a focus on innovation, scalability, and efficiency, TERASi is reshaping how communication technologies are developed and deployed at scale. For more information, visit TERASi
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